exynos7 three electronic components stacked
exynos7 three electronic components stacked 3D model
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exynos7 three electronic components stacked 3D model

Verification details of the FBX file
Files
Binary FBX
Scene
No unsupported objects
Geometry
No N-gonsNo faceted geometryManifold geometry
Textures and Materials
PBR texturesNo embed texturesSquare texturesPower of 2 texture sizesAssigned materials
UVs
No UV overlapsUV unwrapped model
Naming
Allowed characters
Description

This is an AP made by Samsung.The AP plays the same role as the smartphone's brain.

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exynos7 three electronic components stacked
$199.00
 
Editorial No Ai License 
exynos7 three electronic components stacked
$199.00
 
Editorial No Ai License 
8
88omer
(0 reviews)
Response 0% in 48.0h

3D Model formats

Format limitations
Native
  • Lightwave 11 (.lwo, .lw, .lws)22.9 MB
Exchange
  • Autodesk 3ds Max 2015 (.max)19.1 MBVersion: 2015Renderer: V-Ray 300.07
  • OBJ (.obj, .mtl)29 MB
  • Autodesk FBX (.fbx)13.8 KB

3D Model details

  • Ready for 3D Printing
  • Animated
  • Rigged
  • VR / AR / Low-poly
  • PBR
  • Geometry Polygon mesh
  • Polygons 1,385,748
  • Vertices 1,472,288
  • Textures
  • Materials
  • UV Mapping
  • Unwrapped UVs Unknown
  • Plugins used
  • Publish date2022-11-05
  • Model ID#4092848

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